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CMP : Si, GaAs, Poly-Si, SiO2, Metal( Au, Cu, Ni, Sus, Al etc. ),
          Polymer( PR, PMMA, PC, PT etc. ), Ceramic

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Si, GaAs, Glass, Quartz, SOI, SOG, Metal, Polymer :  
  Thickness : 0.1 ~ 20mm
  Tolerance : ±10um
  Chipping  : < 50um

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Diameter : 2" ~ 8"

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Method : CZ, FZ

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Grade : Prime, Test, Dummy

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Type/Dopant : P(Boron), N (Phos, Antimony)

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Orientation : <100>, <111>, <110>

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Resistivity : 0.001 ~ 100,000 Ohm•cm

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Min. Thickness & Tolerance 

2"

3"

4"

5"

6"

50um ±1um

50um ±1um

50um ±1um

90um ±1.5um

100um ±2um

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Max Thickness : 10t

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TTV : 2" ~ 5"(+/- 1um), 6"(+/- 2um) , 8"( +/- 4um)

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Surface : One Side Polished, Double Side Polished

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Diameter : 2" ~ 12"

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Square : 5mm ~ 700mm

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Material : Sodalime, Corning7740, Corning1737, Boro33, B270, ITO Glass Etc.

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Min. Thickness & Tolerance 

2"

3"

4"

5"

6"

50um ±1um

50um ±1um

50um ±1um

90um ±1.5um

100um ±2um

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Max Thickness : 10t

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TTV : 2" ~ 5"( +/- 1um ),   6"( +/- 2um ),   8"( +/- 3um )

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Surface : One Side Polishing, Double Side Polishing

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Diameter : 2" ~ 8"

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Square : 5mm ~ 150mm

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Material : Fused Quartz, Fused Silica

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Min. Thickness & Tolerance 

2"

3"

4"

5"

6"

50um ±1um

50um ±1um

50um ±1um

50um ±1.5um

100um ±2um

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Max Thickness : 10t

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TTV : 2" ~ 5"( +/- 1um ),   6" ( +/- 2um )

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Surface : One Side Polishing, Double Side Polishing

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Ư¼ö wafer :
SOI wafer, SOG Wafer(Si On Glass), GOG Wafer(Glass On Glass), SIMOX wafer, GaAs wafer, HRS wafer, Sapphire wafer.

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Hole °¡°ø service : Sanding, Drilling, Laser

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Jig Á¦ÀÛ : Ceramic, Graphite, Sapphire Jig Á¦ÀÛ

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´ë¸éÀû Si, glass, quartz, Metal °¡°ø ¹× Polishing service

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Thin Film Process Service :
°¢Á¾ Metal ÁõÂø, SiO2, Si3N4, Pattern wafer Á¦ÀÛ


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CMP Service

Dicing / Slicing Service

Si Wafer

Glass Wafer


Quartz Wafer


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Ư¼ö Wafer ¹× ±âŸ °¡°ø Service

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