CMP Service

Dicing/Slicing Service

Si Wafer

Glass Wafer

Quartz Wafer

Ư¼ö Wafer ¹× ±âŸ °¡°ø Service


 

µð¿¡½º¼¼¹ÌÄÜ ÆòÃÌ»ç¿Á Àü°æ

 

ÅùèÁÖ¼Ò: ºÎ¸²·Î170¹ø±æ 41-4

 

µð¿¡½º¼¼¹ÌÄÜ ÆòÃÌ ½Å»ç¿Á ÀÌÀü °øÁö

 

Dicing/Slicing Saws

Back-end & Assembly System

Microscope & Metrology

Others

Wanted Used Equipment

[Semi Automatic Dicing Saw] DAD381
[Semi Automatic Dicing Saw] DAD561
[Wire Bonder] K&S1488 Plus
[Automatic Dicing Saw] DAD 320
[Automatic Dicing Saw] DAD 521
[Automatic Dicing Saw] DAD 560
[Microscope - Leica High Power Set] INM 20
[Automatic Dicing Saw] DAD 640
[Fully Automatic Dicing Saw] DFD 651
[Fully Automatic Dicing Saw] DFD641
[Fully Automatic Dicing Saw] DFD 640
[Semi Automatic Dicing Saw] ADM6D


¡¡

¡¡

¡¡

¡¡