CMP Service

Dicing/Slicing Service

Si Wafer

Glass Wafer

Quartz Wafer

특수 Wafer 및 기타 가공 Service


 

디에스세미콘 평촌사옥 전경

 

택배주소: 부림로170번길 41-4

 

디에스세미콘 평촌 신사옥 이전 공지

 

Dicing/Slicing Saws

Back-end & Assembly System

Microscope & Metrology

Others

Wanted Used Equipment

[Semi Automatic Dicing Saw] DAD381
[Semi Automatic Dicing Saw] DAD561
[Wire Bonder] K&S1488 Plus
[Automatic Dicing Saw] DAD 320
[Automatic Dicing Saw] DAD 521
[Automatic Dicing Saw] DAD 560
[Microscope - Leica High Power Set] INM 20
[Automatic Dicing Saw] DAD 640
[Fully Automatic Dicing Saw] DFD 651
[Fully Automatic Dicing Saw] DFD641
[Fully Automatic Dicing Saw] DFD 640
[Semi Automatic Dicing Saw] ADM6D