◆ PRODUCT BENEFITS:
Zero kerf loss allows higher die density on the wafer
Increased production rates
Chip free results
Less residual stress
No toxic water discharge
No D.I. water costs
More real estate; narrower street widths
◆ PRODUCT FEATURES:
Automatic	Capable of complete, automatic scribing and breaking of many substrate materials
Cost effective	- System integration allows easy hook-up and transport - Superior yield and improved efficiency - Reduced production time
Environmental	No DI or toxic waste water
Versatile	- Fully programmable for all scribing and breaking parameters, including TrueAngle™ diamond tool positioning - Infinitely programmable with Pentium™ powered Windows™ interface
Easy	Few operator adjustments are required when changing between wafer types
◆ SPECIFICATIONS:
Wafer Size:	150 mm max. (6 inch max.)
Minimum Wafer Index:	5 um with Std. Encoders; 1 um with Optional Hi-Res. Encoders
Maximum Wafer Index:	150 mm
Break Method:	Patented impulse bar
Vision System:	Digital Hires BW/Color Camera; 17" Color Monitor; Pattern Recognition System for Auto Alignment, Edge Detection, and Auto Step-Correction
Programmable:	Scribe Tool Life; Scribe Angle; Scribe Approach Speed; Scribe Force; Scribe Speed Scribe Extension; Break Force; Multiple Die Size; Fiducial Image Storage; Wafer Type and Profile; Multiple Wafer Profile Storage. (Profiles programmable in metric or imperial units.)
Wafer Mounting:	Std: Metal Saw Frames (Max 6" wafers - FF105/DY-NFR-007 and FF108/DY-WFR-001; Max 4" wafers - 6" hoops and 7" hoops)
Substrates:	GaAs, LiNbO3, Glass, InP, GaP, Silicon, Quartz